hae_ʻaoʻao

ʻO ka micro thermoelectric cooler (Micro TEC), i kapa ʻia hoʻi ʻo ka micro thermoelectric cooling module, ʻo Micro-peltier module, Micro peltier element, ua hoʻohana nui ʻia ma nā ʻāpana ʻenehana kiʻekiʻe he nui ma muli o kona mau ʻano kino kūikawā a me ka hoʻohālikelike ʻenekinia kiʻekiʻe.

ʻO ka mea hoʻoluʻolu micro thermoelectric (Micro TEC), i kapa ʻia hoʻi ʻo ka module hoʻoluʻolu micro thermoelectric, ʻo ka module Micro-peltier, ʻo Micro peltier element, ua hoʻohana nui ʻia ma nā ʻāpana ʻenehana kiʻekiʻe he nui ma muli o kona mau ʻano kino kūikawā a me ka hoʻohālikelike ʻenekinia kiʻekiʻe. Hoʻopili ʻia kāna mau noi mua ma nā wahi e koi ana i nā pae hana koʻikoʻi - me ke kūpaʻa o ka mahana, ka pane wela wikiwiki, ka compactness spatial, a me ka hoʻohālikelike electromagnetic - e uhi ana i nā kamaʻilio optical, nā mea uila mea kūʻai aku, nā mea hana biomedical, nā mea uila kaʻa, nā ʻōnaehana aerospace a me nā pale, a me nā lako hana pololei ʻoihana.

I. Nā Kamaʻilio Optical (Noi Koʻikoʻi Hoʻolālā)

ʻO Micro TECs, nā modula thermoelectric Micro, nā mea hana Micro peltier e lawelawe ma ke ʻano he mau ʻāpana hoʻomalu mahana koʻikoʻi no nā lasers i nā transceivers optical wikiwiki (e laʻa, 10G, 25G, 100G, 400G, a me 800G modules). Ma ka mālama ʻana i ka mahana o ka hui laser i loko o ±0.1°C, kāohi pono lākou i ka wavelength drift a me ka crosstalk inter-channel, no laila e hōʻoiaʻiʻo ana i ka pono o ka hōʻailona a me ka hilinaʻi i ka hoʻoili ʻikepili bandwidth kiʻekiʻe. ʻO ka piʻi ʻana o ke koi no nā interconnect optical haʻahaʻa-latency, kiʻekiʻe-throughput—i hoʻokele ʻia e ka ʻōnaehana helu AI-intensive i nā kikowaena ʻikepili a me nā hui hoʻomaʻamaʻa AI—ua hoʻolalelale nui i ka ulu ʻana o ka mākeke Micro TEC (micro peltier module). ʻOiai ke noho nei nā hoʻonā kiʻekiʻe e nā alakaʻi honua e like me Ferrotec lāua ʻo KELK, ke holomua nei nā mea hana kūloko i ka hoʻolaha ʻana i nā ʻōnaehana mea thermoelectric, nā ʻenehana hoʻopili hermetic, a me nā hiki ke hoʻohui ʻōnaehana, e hoʻomaʻamaʻa ana i ka localization mālie akā hoʻomau o nā kaulahao lako.

II. Nā Uila Mea kūʻai aku

Hoʻolaha nui ʻia nā Micro TEC, nā modula hoʻoluʻu thermoelectric Micro (miniature peltier module) i nā hoʻonā hoʻokele thermal no nā mea lawe lima a me nā mea liʻiliʻi—me nā clamps hoʻoluʻu kōkua kelepona, nā dispensers wai thermoelectric papapihi (wela/anu), nā mea hana PCR micro-scale, a me nā mini-refrigerators USB-powered. ʻO kā lākou hoʻolālā paʻa—i hōʻike ʻia e nā ʻāpana neʻe ʻole, ka haʻalulu liʻiliʻi, ka walaʻau acoustic haʻahaʻa loa, a me nā kumu ʻano sub-millimeter—e kūlike pono me nā mea nui o ka hoʻolālā i nā mea uila mea kūʻai aku: miniaturization, hana mālie, a me ka hoʻohui maʻalahi.

III. Nā Mea Hana Biomedical

Hoʻohana nā kahua diagnostics in vitro (IVD) a me nā ʻepekema ola i nā modula Micro thermoeletric, nā mea Micro peltier, nā Micro TEC, nā mea miniature peltier no ka hoʻoponopono wela pololei a me ka ikaika.

(1) I loko o nā ʻōnaehana reaction kaulahao polymerase quantitative manawa maoli (qPCR), hiki i nā Micro TEC, nā modules thermoelectric Micro (nā modules Micro TEC) ke hoʻohana i ka paikikala wela millisecond-scale (ka wikiwiki o ka hoʻomehana ≥ 3°C/s; ka wikiwiki o ka hoʻoluʻu ≥ 2°C/s), e hōʻoiaʻiʻo ana i ka kikoʻī o ka hoʻonui ʻana a me ka hana hou ʻana o ka assay;

(2) Mālama nā ipu lawe kaulahao anu lawe lima no nā lāʻau lapaʻau a me nā lāʻau pale i kahi pae hana paʻa 2-8°C, e hoʻokō ana i nā koi prequalification WHO no nā logistics i kāohi ʻia i ka mahana;

(3) I loko o nā mea loiloi hematology a me ke kemika lapaʻau, ʻo ka hoʻoluʻu kūloko o nā mea ʻike kiʻi CCD/CMOS (pae hana: −10°C a i +5°C) e hōʻemi nui ana i ka walaʻau o ke au pouli a hoʻonui i ka lakio signal-to-noise;

(4) I loko o nā mea lapaʻau nani—me nā ʻōnaehana wehe lauoho laser semiconductor-based a me nā kahua kukui pulsed ikaika (IPL)—ʻo nā mea hoʻoluʻolu Micro peltier, Micro TEC, nā modula hoʻoluʻolu micro thermoelectric, hāʻawi i ka hoʻoluʻolu epidermal e hoʻomaikaʻi i ka palekana o ka lāʻau lapaʻau, ka pono, a me ka hōʻoluʻolu o ka mea maʻi.

IV. Nā Uila Kaʻa

Me ka hoʻolaha ʻana o nā kaʻa pili akamai a me nā ʻōnaehana kōkua hoʻokele holomua (ADAS), hoʻohana ʻia nā modula Micro TEC, Micro TEC, a me nā modula thermoelectric Miniature no ka uku wela ma nā ʻāpana transmitter/receiver LiDAR, e hōʻoiaʻiʻo ana i ka hana optical kūlike ma waena o nā kūlana ambient koʻikoʻi (-40°C a i +85°C). Hoʻohui pū ʻia lākou i loko o nā ʻōnaehana hoʻomalu aniau cabin, e like me nā pahu hau akamai i kau ʻia ma ke kaʻa. Hōʻike ʻia me ka hoʻokomo 12 V DC, ka hoʻohana ʻana i ka mana haʻahaʻa (< 5 W maʻamau), ka paʻa mechanical kiʻekiʻe (kūʻē i ka haʻalulu a me ka haʻalulu), a me ka wāwae ultra-compact (< 10 mm²), nā modula thermoelectric Micro, nā modula Micro peltier, nā modula hoʻoluʻu thermoelectric Micro (nā modula thermoelectric micro) e hoʻokō i ka hilinaʻi paʻa o ka pae kaʻa a me nā koi hoʻolālā i kaupalena ʻia i ka wahi.

V. Aerospace a me ka Pale Kaua

Ua hōʻike nā Micro TEC, nā mea hana Micro peltier i ka hana holomua i loko o ka orbit i nā ʻōnaehana hoʻokele wela ukana ukali. No ka laʻana, ua hōʻoia ʻia nā ʻāpana i hoʻomohala ʻia ma ka home ma luna o ke kaʻa hoʻokuʻu "Lianjian-1", e hiki ai ke hoʻoponopono wela ikaika o nā mea uila koʻikoʻi - me nā modula kamaʻilio optical onboard a me nā ʻāpana mokulele focal infrared kiʻekiʻe-ʻike - i loko o ke kaiapuni ākea ʻino. Eia kekahi, kākoʻo lākou i nā mea ʻike infrared airborne a me nā ʻōnaehana kiʻi CCD airborne ʻepekema-pae, kahi e pono ai ke kūpaʻa wela kūikawā no ka ʻike mamao kiʻekiʻe a me ka ʻike kikoʻī ʻana i ka pahuhopu.

VI. Nā Mea Hana Pololei ʻOihana

ʻO nā noi koʻikoʻi e komo pū ana me:

(1) Ka hoʻopaʻa ʻana i ka mahana o nā kumu pamu laser fiber a me nā kumu ultrafast (paʻa ≤ ±0.05°C), e hōʻoiaʻiʻo ana i ke kūlike o ka mana hoʻopuka a me ka kūpaʻa o ka maikaʻi o ke kukuna;

(2) Hoʻomaʻalili hohonu o ka mercury cadmium telluride (MCT) a i ʻole nā ​​mea ʻike infrared HgCdTe i nā mea kiʻi wela a me nā mea kālailai spectroscopic (a hiki i −40°C), e kāohi nui ana i ka walaʻau wela a hoʻomaikaʻi i ka ʻike ʻike;

(3) Hana cryogenic o nā kāmela CMOS ʻepekema i hoʻohana ʻia i ka nānā ʻana o ka astronomical a me ka nānā ʻana i nā hemahema wafer semiconductor, kahi i hoʻemi ʻia ai ke au pouli e hiki ai ke hoʻolōʻihi i nā manawa hōʻike a me ke kiʻi kiʻekiʻe.

(4) Nā modula pale ʻana i ka condensation no nā keʻena hoʻokele uila i nā wahi haʻahaʻa kiʻekiʻe, e hoʻohana ana i ka hoʻoluʻu kūloko e hoʻoponopono pono i ka kiko hau a hōʻoia i ka hilinaʻi hana lōʻihi.

ʻO ke ʻano kūikawā loea a me ka hiki ʻole ke hoʻololi ʻia o ka Micro TEC, micro thermoelectric module mai ka hopena Peltier solid-state, ka mea e hāʻawi ana i kahi pūʻulu synergistic o nā pono:

• Ka mana wela hoʻololi kiʻekiʻe: ka manawa pane wela millisecond-scale; ʻoi aku ka pololei o ka hoʻoponopono mahana paʻa ma mua o ±0.1°C;

• Hana mālie, ʻaʻohe haʻalulu: ka nele o nā mea mīkini e wili ana a hoʻihoʻi ana paha—kūpono no nā noi hoʻonohonoho optical, ʻike, a me ke kiʻi ʻana;

• Hoʻoliʻiliʻi nui ʻia a me ka hiki ke hoʻokomo ʻia: kūlike me ka ʻōpala chip-on-board (COB) a me ka hoʻohui hermetic i loko o nā hale o ka hāmeʻa, e hiki ai ke kaohi wela kūloko ma lalo o ka milimita;

• Ka hoʻomau ʻana o ke kaiapuni: hana me ka ʻole o ka refrigerant; ʻaʻohe hoʻokuʻu ʻana o nā mea hoʻopau ozone a i ʻole nā ​​​​kinoea ʻōmaʻomaʻo; kūlike piha me nā kūlana hoʻoponopono RoHS a me REACH.

 

Nā kikoʻī o TES2-2402T200

ʻO ka mahana wela o ka ʻaoʻao he 27 C,

ʻIke kiʻekiʻe:1.4A,

Umax:1.98V

Qmax:> 0.7 W

ACR: 1.35 ±0.1 Ω

Delta T kiʻekiʻe: 99 C

Nui: Ka nui kumu: 6.6 × 6.6 mm, ka nui luna 4X4mm,

Kiʻekiʻe: 4.9±0.1mm.

Uea: 28 AWG lōʻihi o ke uea hao: 45.7 mm


Ka manawa hoʻouna: Sep-28-2026