Ke holomua wikiwiki nei ka hoʻohana ʻana i nā mea thermoelectric i nā ʻāpana ʻoi loa, i hoʻokele ʻia e nā holomua hoʻololi i ka ʻepekema mea.

Ke holomua wikiwiki nei ka hoʻohana ʻana i nā mea thermoelectric hou i nā ʻāpana ʻoi loa, i hoʻokele ʻia e nā holomua hoʻololi i ka ʻepekema mea. ʻO ka mea nui, ʻo ka hoʻohui synergistic o ka maʻalahi a me ka miniaturization ua hoʻokuʻu i nā ʻenehana hoʻoluʻu thermoelectric mai nā palena o nā hoʻolālā paʻa maʻamau, no laila e wehe ana i nā palena noi hou ma nā ʻāpana ʻenehana kiʻekiʻe he nui:

Nā noi ʻili uila maʻalahi a me ke olakino

ʻO ka puka ʻana mai o nā mea thermoelectric palupalu inorganic—e like me nā composites i hoʻokumu ʻia i ka bismuth telluride (Bi₂Te₃) a me nā chalcogenides kālā—ua lanakila ma luna o ke kūkaʻi lōʻihi ma waena o ka hana thermoelectric kiʻekiʻe a me ka deformability mechanical.

Hoʻēmi ʻana i ka Microscale Hot-Spot: ʻO nā mea hoʻoluʻu thermoelectric Bi₂Te₃-thin Ultra-thin, nā modula hoʻoluʻu thermoelectric (nā modula Peltier) e hoʻokō i ka hōʻemi mahana ma mua o 10 °C ma lalo o ke au hoʻokomo liʻiliʻi (e laʻa, 84 mA), me ka manawa pane wela wikiwiki loa ma kahi o 25 μs. Hiki i kēia ke hoʻokele wela pololei a kūloko no nā kaapuni hoʻohuihui mana kiʻekiʻe, no laila e hoʻonui ai i ka hilinaʻi o ka chip a me ke kūpaʻa hana.

Nā Mea Lapaʻau Hiki ke Hoʻokomo ʻia a me nā Mea Lapaʻau Hiki ke Hoʻokomo ʻia: Ma muli o ko lākou hoʻopili ʻana i nā ʻiʻo olaola—e like me ka ʻili uila—nā mea hana thermoelectric palupalu, nā mea hana peltier, (nā modula thermoelectric) e lawelawe i nā hana ʻelua: (i) ka ʻohi ʻana i ka ikehu wela mai nā gradients kino-ambient e hoʻoikaika i nā sensor biomedical mana haʻahaʻa loa (e like me nā mea nānā i ka helu puʻuwai hoʻomau); a me (ii) ka hiki ʻana i ka ʻike wela kiʻekiʻe, i hoʻonā ʻia ma kahi no ka ʻike mua ʻana i ka mumū kūloko, ka loiloi ʻana i nā anomalies perfusion koko peripheral, a me ka hoʻoponopono wela ikaika i nā mea hana implantable hanauna hou—me nā neural interfaces a me nā interfaces lolo-kamepiula.

Nā Kaiapuni Koʻikoʻi a me nā ʻŌnaehana Aerospace

ʻO ka ulu ʻana o ka ʻoihana o nā semiconductors wide-bandgap o ke kolu o ka hanauna—ʻoiai ʻo ka silicon carbide (SiC) a me ka gallium nitride (GaN)—e hoʻonui mālie nei i ka envelope hana o nā mea semiconductor, nā modula thermoelectric, nā modula TEC (peltier modules) i nā kūlana koʻikoʻi.

ʻIke Wela Kiʻekiʻe a me ka Mana Wela: ʻO ke anakahi uila haki kiʻekiʻe kūloko, ke kūpaʻa wela kūikawā, a me ka hoʻomanawanui radiation o SiC a me GaN e hiki ai ke hana ikaika o nā ʻōnaehana ʻike mahana a me nā ʻōnaehana kaohi wela hana i nā wahi koʻikoʻi o ka misionari—e komo pū ana me nā kahua aerospace a me ka nānā ʻana i nā kaʻina hana ʻoihana wela kiʻekiʻe—kahi e koʻikoʻi ai ka pololei paʻa, ka hilinaʻi, a me ke ola lōʻihi.

ʻO ka Robotics Akamai a me ka ʻIke Tactile

ʻOi aku ka hana hou o nā mea ma mua o ka hoʻokele wela e kākoʻo i nā holomua holoʻokoʻa i nā mea uila maʻalahi. No ka laʻana, ua hana nā kānaka noiʻi i kahi sensor tactile matrix hana me ka hoʻohana ʻana i nā semiconductors ʻelua-dimensional ultrathin, mechanically compliant (e laʻa, molybdenum disulfide). Ke hoʻohui ʻia ma luna o nā mea paʻa robotic palupalu, ʻike kēia sensor i nā mea hoʻoulu kaomi sub-millipascal-level—e like me ka ikaika mālie o ke au ea ma ka ʻili kanaka—a laila e hāʻawi ana i nā mīkini me ka acuity tactile e like me ke kanaka. ʻO ka hui ʻana o ia ʻike tactile kiʻekiʻe me ka hoʻokele thermal adaptive e hoʻokumu i kahi kahua lako kumu no nā ʻōnaehana robotic biomimetic, autonomous e hiki mai ana.

Ka Unuhi ʻOihana a me ke Kūʻokoʻa ʻenehana Kūloko

Ma ka ʻāina holoʻokoʻa, ke hoʻolalelale nei nā hana i hui pū ʻia e nā ʻoihana noiʻi a me nā mea kuleana o ka ʻoihana i ka hoʻololi ʻana o nā hana hou o nā mea hana ma ke ʻano he keʻena hoʻokolohua i nā huahana kūpono i ke kālepa. ʻO kahi hiʻohiʻona koʻikoʻi ʻo ia ka Shanghai Institute of Ceramics, Chinese Academy of Sciences, nāna i laikini i nā palapala hoʻopaʻa inoa he nui ma nā thermoelectrics inorganic plastic—e hoʻomaʻalahi ana i kā lākou hoʻolaha ʻana i ka hoʻopaʻa ʻana o ka modula optical thermal, ka hoʻolaha wela kiʻekiʻe o ka chip, a me nā noi microsensor ponoʻī. Hōʻike kēia mau hoʻomohala i ka holomua holomua o Kina i ka hilinaʻi ʻenehana ponoʻī i nā mea semiconductor holomua, e hōʻemi ana i ka hilinaʻi ʻana i nā kaulahao lako haole a me ka hoʻoikaika ʻana i ka hiki kūloko no ka hana hou hoʻolālā.